TDA3MVRBFABFRQ1

制造商 :

Texas Instruments

产品分类 :

嵌入式 > 片上系统 (SoC)

Architecture :

DSP, MPU

Connectivity :

CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB

Core Processor :

ARM® Cortex®-M4, C66x

Flash Size :

-

Operating Temperature :

-40°C ~ 125°C (TJ)

Package / Case :

367-BFBGA, FCBGA

Peripherals :

DMA, PWM, WDT

Primary Attributes :

-

Product Status :

Active

RAM Size :

512kB

Speed :

212.8MHz, 745MHz

Supplier Device Package :

367-FCBGA (15x15)